Hakan Ertürk

Title: 
Associate Professor
Room / Office: 
M4325
Phone Number: 
+90 212 359 7356
Fax Number: 
+90 212 287 2456
hakan.erturk@boun.edu.tr
Degrees: 
  • Ph.D. 2002, Mechanical Engineering, University of Texas, Austin, TX, USA
  • M.S. 1997, Mechanical Engineering, ODTU, Ankara, Turkey
  • B.S. 1994, Mechanical Engineering, ODTU, Ankara, Turkey
Experience: 
  • Assoc. Professor, Boğaziçi University, Department of Mechanical Engineering, 2012-
  • Assistant Professor, Boğaziçi University, Department of Mechanical Engineering, 2007-2012
  • Senior Packaging Engineer, Intel Corporation, Chandler, AZ, USA, 2003-2007
Courses Taught: 
  • ME 263: Thermodynamics
  • ME 362: Heat Transfer
  • ME 429: Mechanical and Thermal Design
  • ME 466: Thermodynamics II
  • ME 478: Design of Thermal Systems
  • ME 492: Project
  • ME 561: Conduction Heat Transfer
  • ME 579: Graduate Seminar
  • ME 662: Convection Heat Transfer
  • ME 663: Radiation Heat Transfer
Research Interests: 
  • Design and control of thermal and energy systems
  • Nanotechnology in energy applications
  • Thermal management of opto/electronic systems
  • Inverse problems of thermal design and sensing
Publications: 

Journal Articles

  • Rostampour Fathi Z, Menguc P, Erturk H, 2018, " Plasmon coupling between complex gold nanostructures and a dielectric substrate ", Applied Optics, accepted, in press. (SCI)
  • Ericok OB, and Erturk H, 2018, "Optical characterization limits of nanoparticle aggregates at different wavelengths using Approximate Bayesian Computation", Journal of Quantitative Spectroscopy and Radiative Transfer, vol.213, pp.113-118. (SCI)
  • Yalcin RA, and Erturk H, 2018, “Inverse Design of Spectrally Selective Thickness Sensitive Pigmented Coatings for Solar Thermal Applications", Transactions of ASME Journal of Solar Energy Engineering, vol.140, 031006. (SCI)
  • Ericok OB, Cemgil TA, Erturk H, 2018, “Approximate Bayesian Computation Techniques for Optical Characterization of Nanoparticle Clusters” Journal of Optical Society of America –A, vol.35, no.1, pp.88-97. (SCI)
  • Akiner T, Mason JK, Erturk H, “Thermal Characterization Assessment of Rigid and Flexible Water Models in a Nanogap Using Molecular Dynamics”, Chemical Physics Letters, vol.687, pp.270-275.  (SCI)
  • Akiner T, Mason JK, Erturk H, 2017, “Nanolayering Around and Thermal Resistivity of the Water Hexagonal Boron Nitride Interface”, Journal of Chemical Physics, vol.147, 044709.  (SCI)
  • Ericok OB, and Erturk H, "Inverse Characterization of Nanoparticle Clusters using Unpolarized Optical Scattering without Ex-Situ Measurements", Journal of Quantitative Spectroscopy and Radiative Transfer, vol.198, pp.117-129. (SCI)
  • Kazemi Khosrashahi F, Erturk H, Menguc MP, 2017, "Optimization of Si/SiO2 Based Spectrally Selective Filters for Thermophotovoltaic Devices ", Journal of Quantitative Spectroscopy and Radiative Transfer, vol. 197, pp. 123-131. (SCI)
  • Talebi Moghaddan S, Avsar D, Erturk H, Menguc MP, 2017, " Effect of Silicon AFM Probe’s Spatial Location on Local Absorption of Gold Nano-Structures Placed on a Dielectric Surface", Journal of Quantitative Spectroscopy and Radiative Transfer, vol. 197, pp. 106-113.  (SCI)
  • Ilhan B, Erturk H, 2017, “Experimental Characterization of Laminar Forced Convection of hBN Water Nanofluid in a Circular Tube”, International Journal of Heat and Mass Transfer, vol. 111, pp.500-507.  (SCI)
  • Akiner T, Mason JK, Erturk H, 2016, “A New Interlayer Potential For Hexagonal Boron Nitride”, Journal of Physics: Condensed Matter, vol.28, 385401.  (SCI)
  • Ilhan B, Kurt M, Erturk H, 2016, “Experimental Investigation of Heat Transfer Enhancement and Viscosity Increase of hBN Nanofluids”, Experimental Thermal and Fluid Sciences, vol.77, pp.272-283.  (SCI)
  • Talebi Moghaddan S, Erturk H, Menguc MP, 2016, “Enhancing Local Absorption Patterns within Gold Nano-Structures on a Dielectric Surface under an AFM Probe and with Evanescent-Wave Illumination”, Journal of Quantitative Spectroscopy and Radiative Transfer, vol.178, pp.124-133.  (SCI)
  • Heshmati F, Erturk H, 2016, “Single Phase Models for Improved Estimation of Friction Factor for Laminar Nanofluid Flow in Pipes”, International Journal of Heat and Mass Transfer, vol.95C, pp. 416-425. (SCI)
  • Goktepe S, Atalik K, Erturk H, 2014, “Comparison of Single and Two-Phase Models for Nanofluid Convection at the Entrance of a Uniformly Heated Tube”, International Journal of Thermal Sciences, vol.80, no.1, pp.83-92. (SCI)
  • Erturk, H., 2011, “Evaluation Of Image Reconstruction Algorithms For Non-Destructive Characterization Of Thermal Interfaces”, International Journal of Thermal Sciences, vol.50, no.6, pp.906-917.  (SCI)
  • Erturk, H. and Howell, J. R., 2010, “Efficient Signal Transport Model for Remote Thermometry in Full Scale Systems”, IEEE Transactions on Semiconductor Manufacturing, vol.23, no.1., pp.132-140.  (SCI)
  • Erturk, H., Gamba, M., Ezekoye, O.A., and Howell, J.R., 2008, “Validation of Inverse Boundary Condition Design in a Thermometry Test Bed”, Journal of Quantitative Spectroscopy and Radiative Transfer, vol. 109, pp.317-326. (SCI)
  • Sauciuc, I., Erturk, H., Sahasrabudhe, S.H., Girouard, S., Bosak, H.C., Ahuja, S., Chrysler, G.M., Leija, J., 2006, “Future CPU Cooling Building Blocks: Performance and Challenges”, Intel Assembly Test and Technology Journal, vol.9, pp.31-42.
  • Sauciuc, I., Chang, J-Y, Chau, D., Chrysler, G., Prasher, R., Erturk, H., 2004, “Novel Thermal Technologies for CPU Cooling Applications”, Intel Assembly Test and Technology Journal, vol. 7, pp. 63-71.
  • Erturk, H., Ezekoye, O. A., and Howell, J. R., 2004, “Boundary Condition Design to Heat a Moving Object at Uniform Transient Temperature”, ASME Journal Manufacturing Science and Engineering, vol. 126, pp.619-626. (SCI)
  • Howell, J. R., Daun, K. J., Erturk, H., Gamba, M. and Hosseini Sarvari, M., 2003, “The Use of Inverse Methods for the Design and Control of Radiant Sources”, JSME International Journal, Series B, Fluid and Thermal Engineering, vol. 46, pp.470-478. (SCI-E) (invited paper)
  • Daun, K. J., Erturk, H. and Howell, J. R., 2002, “Inverse Methods for High Temperature Systems”, Arabian Journal for Science and Engineering, vol. 27, no 2C, pp. 3-48.  (SCI-E) (invited paper)
  • Erturk, H., Ezekoye, O. A., and Howell, J. R., 2002, “The Application of An Inverse Formulation In The Design of Boundary Conditions for Transient Radiating Enclosures”, ASME Journal of Heat Transfer, vol.124, pp. 1095-1102. (SCI)
  • Erturk, H., Ezekoye, O. A., and Howell, J. R., 2002, “Comparison of Three Regularized Solution Techniques in a Three-Dimensional Inverse Radiation Problem”, Journal of Quantitative Spectroscopy and Radiative Transfer, vol.73, pp. 307-316. (SCI)

 

Patents

  • Z. Li, C.-C. Hsieh, J. Hu, H. Erturk, and G. Chen, “Microfins for Cooling an Ultramobile Device”, US Patent No. US8482922.
  • Z. Li, C.-C. Hsieh, J. Hu, H. Erturk, and G. Chen, “Microfins for Cooling an Ultramobile Device”, US Patent No. US8054629.
  • Erturk, H., Sauciuc, I., “Piezoelectric Fan, Method of Cooling a Microelectronic Device Using Same, and System Containing Same”, US Patent application no. US2009026881-A1; Korean Patent No. KR1004161-B1; Chinese Patent application no. CN101354045-A.
  • Sauciuc, I., Chrysler, G.M., Erturk, H., 2009, “Piezoelectric Air Jet Augmented Cooling for Electronic Devices”, US Patent No. US7633753; Korean Patent No. KR1031487-B1; Chinese Patent No. CN101516173-B.
  • Erturk, H., Chrysler, G.M., Sauciuc, I., 2008, “Method and System to Cool Memory”, US Patent No. US7457116
  • Erturk, H., Sauciuc, I., 2008, “Heat Dissipating Device with Enhanced Boiling/Condensation Structure”, US Patent No. US7353860; Taiwanese Patent No. TW293018-B1; International Patent No. WO2006007163; Korean Patent No. KR2007017205-A; Chinese Patent No. CN1969382-B; German Patent Nos. DE112005001365-T5, DE112005001365-B4.
  • Erturk, H., Sauciuc, I., 2008, “Heat Dissipating Device with Enhanced Boiling/Condensation Structure”, US Patent No. US7327572.
  • Erturk, H., Sauciuc I., 2007, “Cooling Integrated Circuits Using a Cold Plate with Two Phase Thin Film Evaporation”, US Patent No. US7265979.
  • Erturk H., Sauciuc I., Unrein, E. J., 2005, “An Apparatus and Method for Cooling Integrated Circuit Devices”, US Patent No. US6917522.

 

Book Chapters

  • Hottel H.C., Sarofim A.F., Noble J.J., and Ertürk H., “Radiant Heat Transfer”, eds. AM Sadegh and WM. Worek, Mark’s Handbook, 12th ed., Mc. Graw Hill (in press).
  • Erturk H and Howell JR, “The Monte Carlo method for Radiative Heat Transfer”, Handbook of Thermal Sciences and Engineering, ed. F. Kulacki, Springer.